MDA manufacturing defects analyses
For each product we construct a pinbed analyses tool. Through numerous pins that contact the PCB backside all contacts are being measured and tested.
Defect components or malicious soldering will be discovered through this test
Defect components or malicious soldering will be discovered through this test
Optical test
First there is the Optical Inspection where it is made sure that all components are rightly place. This can either be a visual inspection or automated through a so called AOI scanner. AOI refers to Automated Optical Inspection.
MDA test
Secondly there is the MDA test. MDA stands for Manufacturing Defects Analyses. All components are measured through the pin bed method on placement and whether they have the right value and properties.
Functional test
Thirdly we perform a Functional Test by which we make sure the print functions as it should. This can be done via connectors or via a pin bed device which makes contact to dedicated contact points on the backside of the PCB.
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